DSC POWER 864 - REV2 Especificaciones descargar pdf (Pagina 214)

PIC24F16KA102 FAMILY

29.1 DC Characteristics

FIGURE 29-1: PIC24F16KA102 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)

TABLE 29-1: THERMAL OPERATING CONDITIONS

Rating Symbol Min Typ Max Unit

Operating Junction Temperature Range T

J -40 — +125 °C

Operating Ambient Temperature Range TA -40 — +85 °C

Power Dissipation:

Internal Chip Power Dissipation:

INT = VDD x (IDD – Σ IOH)

PD PINT + PI/O W

I/O Pin Power Dissipation:

I/O = Σ ({VDD – VOH} x IOH) + Σ (VOL x IOL)

Maximum Allowed Power Dissipation PDMAX (TJ – TA)/θJA W

Frequency

Voltage (VDD)

1.80V

32 MHz

3.60V

3.00V

3.60V

8 MHz

3.00V

Note: For frequencies between 8 MHz and 32 MHz, FMAX = 20 MHz *(VDD – 1.8) + 8 MHz.

TABLE 29-2: THERMAL PACKAGING CHARACTERISTICS

Characteristic Symbol Typ Max Unit Notes

Package Thermal Resistance, 20-Pin PDIP θJA 62.4 — °C/W 1

Package Thermal Resistance, 28-Pin SPDIP θJA 60 — °C/W 1

Package Thermal Resistance, 20-Pin SSOP θJA 108 — °C/W 1

Package Thermal Resistance, 28-Pin SSOP θ

JA 71 — °C/W 1

Package Thermal Resistance, 20-Pin SOIC θ

JA 75 — °C/W 1

Package Thermal Resistance, 28-Pin SOIC θ

JA 80.2 — °C/W 1

Package Thermal Resistance, 20-Pin QFN θ

JA 43 — °C/W 1

Package Thermal Resistance, 28-Pin QFN θJA 32 — °C/W 1

Note 1: Junction to ambient thermal resistance, Theta-JA (θJA) numbers are achieved by package simulations.

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DSC POWER 864 - REV2 Especificaciones Pagina 214